Testing & Box Build
Flipchip Electronics provides dedicated testing and box build services for OEMs and product companies requiring complete product integration beyond PCB assembly. Our facility supports electro-mechanical assembly, subsystem integration, enclosure fitment, functional testing, packaging, and shipment preparation — delivering reliable, production-ready products with streamlined operational efficiency.
Comprehensive testing and box build services including electro-mechanical assembly, subsystem integration, enclosure assembly, functional validation, and shipment-ready product preparation.
Key Capabilities
Key Benefits
End-to-End Product Assembly
Complete product integration and box build services managed under one roof.
Improved Product Reliability
Dedicated testing and validation processes ensure consistent product quality.
Reduced Operational Complexity
Eliminate the need for multiple vendors by consolidating assembly and testing.
Faster Deployment
Shipment-ready products reduce turnaround time for final customer delivery.
Our Process
Requirement Analysis
Review customer assembly, testing, and packaging requirements.
Subsystem Assembly
Mechanical and electrical subsystem integration with cable routing.
Box Build Integration
Complete enclosure assembly and product-level integration.
Testing & Validation
Functional, burn-in, and quality validation testing of final units.
Packaging & Labeling
Custom labeling, documentation, and secure packaging preparation.
Dispatch Readiness
Final inspection and shipment-ready handover for logistics.
